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NEK IEC PAS 62177:2000

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The highly-accelerated temperature and humidity stress test is performed for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. It employs severe conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors which pass through it.

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  • Varetype: PAS
  • Products.Specs.pages
  • ICS 31.080.01
  • National Committee TC 47

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