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NEK IEC 63011-1:2018

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IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Utgave: 1.0
  • Versjon: 1
  • Varetype: NAT
  • Products.Specs.pages
  • ICS 31.200
  • National Committee NEK/NK47