Standard

NEK IEC 63011-1:2018

Published

Corrigendums and amendments are bought separately.

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Abstract

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Document information

  • Standard from NEK
  • Published:
  • Edition: 1.0
  • Version: 1
  • Document type: NAT
  • Pages
  • ICS 31.200
  • National Committee NEK/NK47