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Standard

NEK IEC 60286-3:2013

Tilbaketrukket

Merknad: Denne standarden har en ny utgave: NEK IEC 60286-3:2022

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Rettelser og tillegg kjøpes separat.

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Omfang

IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Tilbaketrukket:
  • Utgave: 5.0
  • Versjon: 1
  • Varetype: NAT
  • Products.Specs.pages
  • ICS 31.020
  • ICS 31.240
  • National Committee NEK/NK40

Produktrelasjon