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IEC 60749-30:2020 ED2

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IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.

Dokumentinformasjon

  • Standard fra IEC
  • Publisert:
  • Utgave: 2
  • Versjon: 1
  • Varetype: IS
  • Products.Specs.pages
  • ICS 31.080.01
  • ISO TC TC 47

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