Standard

NS-EN ISO 9455-14:2017

Dec 2017 Published

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Language English

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Abstract

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Document information

Standard from SN
Published: 1 December 2017
Edition: 2017-09
Version: 1
Document type: NAT
ISBN:

ICS 25.160.50
National Committee SN/K 58

Product Relations

Replaces: NS-EN 29455-14:1993
Refers: ISO 197-1:1983
Adopted from: EN ISO 9455-14:2017 , 0

Product life cycle

Previous product

Withdrawn

NS-EN 29455-14:1993
Current product

Published

NS-EN ISO 9455-14:2017

NS-EN ISO 9455-14:2017

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