Standard

NEK IEC TR 62258-4:2007

Aug 2007 Withdrawn

Note: This standard has a new edition: NEK IEC TR 62258-4:2012

Corrigendums and amendments are bought separately.

Language English

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Abstract

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1 and IEC 62258-2 standards.

Document information

Standard from NEK
Published: 20 August 2007
Withdrawn: 4 March 2015
Edition: 1.0
Version: 1
Document type: TR
Pages
ISBN:

ICS 31.080.99
National Committee NEK/NK47

Product Relations

Adopted from: IEC 62841-1:2014+AMD1:2025 CSV
Adopted from: IEC 62841-1:2014 ED1
Replaced by: NEK IEC TR 62258-4:2012

NEK IEC TR 62258-4:2007

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