Standard

NEK IEC PAS 62190:2000

Withdrawn

Corrigendums and amendments are bought separately.

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Abstract

Aims at identifying the classification level of nonhermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.

Document information

  • Standard from NEK
  • Published:
  • Withdrawn:
  • Edition: 1.0
  • Version: 1
  • Document type: PAS
  • Pages
  • ICS 31.080.01
  • National Committee TC 47

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