Standard

NEK IEC PAS 62170:2000

Aug 2000 Withdrawn

Corrigendums and amendments are bought separately.

Language English

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Abstract

Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.

Document information

Standard from NEK
Published: 24 August 2000
Withdrawn: 17 May 2004
Edition: 1.0
Version: 1
Document type: PAS
ISBN:

ICS 31.080.01
National Committee NEK/NK47

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Adopted from: IEC 61290-1-1:2015 ED3
Adopted from: IEC PAS 62170:2000

NEK IEC PAS 62170:2000

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Abstract

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Abstract

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