Standard

NEK IEC PAS 62137-3:2008

Nov 2008 Withdrawn

Corrigendums and amendments are bought separately.

Language English

Services Read Online (No printing ) kr 4 297,00 Printed and bound Delivery time: 5-10 days kr 5 371,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Document information

Standard from NEK
Published: 13 November 2008
Withdrawn: 8 November 2011
Edition: 1.0
Version: 1
Document type: PAS
ISBN:

ICS 31.190
National Committee TC 91

Product Relations

Replaced by: NEK IEC 62137-3:2011
Adopted from: IEC PAS 62137-3:2008

NEK IEC PAS 62137-3:2008

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Abstract

Document information

Product Relations

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

Document information

Product Relations