Standard

NEK IEC PAS 62084:1998

Dec 1998 Withdrawn

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Language English

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Abstract

Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier.

Document information

Standard from NEK
Published: 3 December 1998
Withdrawn: 2 December 2004
Edition: 1.0
Version: 1
Document type: PAS
ISBN:

ICS 31.200
National Committee NEK/NK91

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Adopted from: IEC PAS 62084:1998 , 0

NEK IEC PAS 62084:1998

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Abstract

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Abstract

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