Standard

NEK IEC 63378-6:2026

Feb 2026 Published

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Language English

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Abstract

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

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Standard from NEK
Published: 8 February 2026
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.080.01

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Adopted from: IEC 63378-6:2026

NEK IEC 63378-6:2026

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Abstract

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