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Standard

NEK IEC 63378-2-1:2024

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Abstract

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

Document information

  • Standard from NEK
  • Published:
  • Edition: 1.0
  • Version: 1
  • Document type: NAT
  • ICS 31.080.01
  • National Committee NEK/NK47

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  • Adopted from: IEC 63378-2-1:2024