Standard

NEK IEC 62047-16:2015

Mar 2015 Published

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Language English

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Abstract

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

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Standard from NEK
Published: 5 March 2015
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.080.99
National Committee TC 47/SC 47F

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Adopted from: IEC 62047-16:2015

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Abstract

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Abstract

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