Standard

NEK IEC 61760-1:2006

Apr 2006 Withdrawn

Note: This standard has a new edition: NEK IEC 61760-1:2020

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern: - requirements related to lead-free soldering; - extension of the scope to include also components mounted by gluing; - direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat; - classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

Document information

Standard from NEK
Published: 10 April 2006
Withdrawn: 14 July 2020
Edition: 2.0
Version: 1
Document type: NAT
ISBN:

ICS 31.240
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 61760-1:2020
Replaces: NEK IEC 61760-1:1998
Adopted from: IEC 60841:1988 ED1
Adopted from: IEC 61760-1:2006

NEK IEC 61760-1:2006

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NEK IEC 61760-1:2020