Standard

NEK IEC 61192-2:2003

Mar 2003 Withdrawn

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Abstract

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

Document information

Standard from NEK
Published: 14 March 2003
Withdrawn: 30 November 2018
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.190
National Committee NEK/NK91

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Adopted from: IEC 60684-3-209:2003 ED2
Adopted from: IEC 61192-2:2003

NEK IEC 61192-2:2003

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Abstract

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Abstract

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