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Redline

NEK IEC 60749-30:2020 RLV

Published

Note: This standard has a new edition: NEK IEC 60749-30:2020

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Abstract

IEC 60749-30:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.

Document information

  • Redline from NEK
  • Published:
  • Edition: 2.0
  • Version: 1
  • Document type: NAT
  • Pages
  • ICS 31.080.01
  • National Committee NEK/NK47

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  • Adopted from: IEC 60749-30:2020 RLV