Standard

NEK IEC 60749-30:2005

Jan 2005 Withdrawn

Note: This standard has a new edition: NEK IEC 60749-30:2020

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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing Withdrawn NEK IEC 60749-30:2005/AMD1:2011 Amendment from Publication date: May 2011 Version: 1 Pages: 20 Language: English Services: Read Online (No printing ), Printed and bound

Abstract

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Document information

Standard from NEK
Published: 20 January 2005
Withdrawn: 17 August 2020
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-30:2020
Merged into: NEK IEC 60749-30:2005+A1:2011 CSV
Replaces: NEK IEC PAS 62182:2000
Adopted from: IEC 60388-1:1972 ED1

NEK IEC 60749-30:2005

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NEK IEC 60749-30:2020