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Consolidated

NEK IEC 60317-20:2013+A1:2019 CSV

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Abstract

IEC 60317-20:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a sole coating based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements.NOTE: A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:- Grade 1: 0,018 mm up to and including 0,800 mm;- Grade 2: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This third edition cancels and replaces the second edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;- modification to Clause 15 to remove specific wire specimen sizes;- consolidation of 17.1 and 17.2 of the solderability requirements;- modification to Clause 19, Dielectric dissipation factor;- new Clause 23, Pin hole test.This consolidated version consists of the third edition (2013) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.Key words: requirements of solderable enamelled round copper winding wire, class 155, sole coating based on polyurethane resin

Document information

  • Consolidated from NEK
  • Published:
  • Edition: 3.1
  • Version: 1
  • Document type: NAT
  • Pages
  • ICS 29.060.10
  • National Committee NEK/NK55

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