Standard

NEK IEC 60191-6-18:2010

Jan 2010 Published

Corrigendums and amendments are bought separately.

Language English

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Standard

NEK IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Jan 2010 Published
Standard

NEK IEC PAS 60191-6-18:2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Jan 2008 Withdrawn

Abstract

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

Document information

Standard from NEK
Published: 7 January 2010
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaces: NEK IEC PAS 60191-6-18:2008
Adopted from: IEC 60092-351:1983 ED1
Adopted from: IEC 60191-6-18:2010

NEK IEC 60191-6-18:2010

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