Standard

NEK IEC 60191-5:1997

Apr 1997 Published

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Language English

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Abstract

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Document information

Standard from NEK
Published: 23 April 1997
Edition: 2.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee TC 47/SC 47D

Product Relations

Adopted from: IEC 61158-3-14:2014 ED3
Replaces: NEK IEC 60191-5:1987

NEK IEC 60191-5:1997

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