Standard

NEK IEC 60068-2-54:2006

Apr 2006 Withdrawn

Note: This standard has a new edition: NEK IEC 60068-2-54:2006

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Language English

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Abstract

IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).

Document information

Standard from NEK
Published: 27 April 2006
Withdrawn: 7 March 2017
Edition: 2.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 19.040
ICS 31.020
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 60068-2-69:2017
Replaces: NEK IEC 60068-2-54:1985
Adopted from: IEC 60068-2-54:2006

NEK IEC 60068-2-54:2006

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