Standard

NEK EN IEC 61760-2:2021

Oct 2021 Published

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Language English

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Abstract

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

Document information

Standard from NEK
Published: 1 October 2021
Edition: 2021-09
Version: 1
Document type: NAT
ISBN:

ICS 31.240
National Committee NEK/NK91

Product Relations

Referred by: NEK EN 61760-4:2015
Replaces: NEK EN 61760-2:2007
Adopted from: EN IEC 61760-2:2021 , 0

NEK EN IEC 61760-2:2021

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