Standard

JEDEC JESD51-32

Published

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Abstract

This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to implement these connections. The extensions described below also are applicable to single chip packages needing more than 36 electrical connections for the test.

Document information

  • Standard from JEDEC_AC
  • Published:
  • Version: 0
  • Document type: IS