Standard

ISO 9455-17:2002

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Note: This standard has a new edition: ISO 9455-17:2024

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Abstract

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Document information

  • Standard from ISO
  • Published:
  • Withdrawn:
  • Expires:
  • Edition: 1
  • Version: 1
  • Document type: IS
  • ICS 25.160.50
  • ISO TC ISO/TC 44/SC 12

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