Standard

IEC 62878-2-5:2019 ED1

Sep 2019 Published

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Abstract

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers. IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

Document information

Standard from IEC
Published: 16 September 2019
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 9782832273999

ICS 31.180
ICS 31.190
ISO TC TC 91

Product Relations

Revises: IEC PAS 62878-2-5:2015 ED1
Adopted by: NEK IEC 61174:1998
FRANKFURT AGREEMENT: prEN IEC 62878-2-5:2019

IEC 62878-2-5:2019 ED1

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