Standard

IEC 62769-6:2023 ED3

Apr 2023 Published

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Field Device Integration (FDI®) - Part 6: FDI Technology Mappings Published IEC 62769-6:2023 RLV Redline Publication date: Apr 2023 Language: English Services: Read Online (No printing ), Printed and bound

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

Document information

Standard from IEC
Published: 6 April 2023
Edition: 3
Version: 1
Document type: IS
Pages
ISBN:

ICS 25.040.40
ICS 35.100.05
ISO TC TC 65/SC 65E

Product Relations

Revises: IEC 62769-6:2021 RLV
Revises: IEC 62769-6:2021 ED2
Adopted by: NEK IEC 61156-5:2020
FRANKFURT AGREEMENT: prEN IEC 62769-6:2022

IEC 62769-6:2023 ED3

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