Standard

IEC 62258-1:2005 ED1

Aug 2005 Revised

Note: This standard has a new edition: IEC 62258-1:2009 ED2

Corrigendums and amendments are bought separately.

Language English

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Abstract

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.

Document information

Standard from IEC
Published: 30 August 2005
Withdrawn: 7 April 2009
Edition: 1
Version: 1
Document type: IS
ISBN: 2831881668

ICS 31.080.99
ISO TC TC 47

Product Relations

Adopted by: NEK ISO/IEC 19788-5:2012
Revised by: IEC 62258-1:2009 ED2

Product life cycle

Current product

Revised

IEC 62258-1:2005 ED1
Stage 99.60
Revised by

Published

IEC 62258-1:2009 ED2

IEC 62258-1:2005 ED1

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IEC 62258-1:2009 ED2