Standard

IEC 61760-4:2015 ED1

May 2015 Published

Note: This standard has a new edition: IEC 61760-4:2015+AMD1:2018 CSV

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Language English English/French

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Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices Published IEC 61760-4:2015/AMD1:2018 ED1 Amendment from Publication date: Mar 2018 Version: 1 Language: English, English/French Services: Read Online (No printing ), Printed and bound

Abstract

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Document information

Standard from IEC
Published: 19 May 2015
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.190
ISO TC TC 91

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IEC 61760-4:2015 ED1

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IEC 61760-4:2015+AMD1:2018 CSV