Standard

IEC 61760-3:2010 ED1

Revised

Note: This standard has a new edition: IEC 61760-3:2021 ED2

Preview

Corrigendums and amendments are bought separately.

Language
Services

Abstract

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

Document information

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Version: 1
  • Document type: IS
  • ICS 31.190
  • ISO TC TC 91

Product Relations

Product life cycle