Standard

IEC 61760-2:1998 ED1

Feb 1998 Revised

Note: This standard has a new edition: IEC 61760-2:2021 ED3

Corrigendums and amendments are bought separately.

Language English/French

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Abstract

Describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble free processing of surface mounting devices, both active and passive. The object of this International Standard is to ensure that users of SMDs receive and store products that can be further processed without prejudice to quality and reliability.

Document information

Standard from IEC
Published: 26 February 1998
Withdrawn: 24 April 2007
Edition: 1
Version: 1
Document type: IS
ISBN: 2831842980

ICS 31.020
ISO TC TC 91

Product Relations

Revised by: IEC 61760-2:2007 ED2

Product life cycle

Current product

Revised

IEC 61760-2:1998 ED1
Stage 99.60
Revised by

Revised

IEC 61760-2:2007 ED2

IEC 61760-2:1998 ED1

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IEC 61760-2:2021 ED3

IEC 61760-2:2007 ED2