Standard

IEC 61709:1996 ED1

Oct 1996 Revised

Note: This standard has a new edition: IEC 61709:2017 ED3

Corrigendums and amendments are bought separately.

Language English/French

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Abstract

Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.

Document information

Standard from IEC
Published: 17 October 1996
Withdrawn: 24 June 2011
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.020
ISO TC TC 56

Product Relations

Revised by: IEC 61709:2011 ED2
Replaces: IEC 60863:1986 ED1

IEC 61709:1996 ED1

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IEC 61709:2017 ED3

IEC 61709:2011 ED2