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Standard

IEC 61192-3:2002 ED1

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Abstract

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Document information

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Version: 1
  • Document type: IS
  • ICS 31.190
  • ISO TC TC 91

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