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Standard

IEC 61190-1-3:2002 ED1

Revised

Note: This standard has a new edition: IEC 61190-1-3:2017 ED3

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Abstract

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Document information

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Version: 1
  • Document type: IS
  • ICS 31.190
  • ISO TC TC 91

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