Standard

IEC 61189-3-302:2025 ED1

Oct 2025 Published

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Abstract

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes.

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Standard from IEC
Published: 22 October 2025
Edition: 1
Version: 1
Document type: IS
ISBN: 9782832707777

ICS 31.180
ISO TC TC 91

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IEC 61189-3-302:2025 ED1

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Abstract

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