Consolidated

IEC 60749-30:2005+AMD1:2011 CSV

Aug 2011 Revised

Note: This standard has a new edition: IEC 60749-30:2020 ED2

Corrigendums and amendments are bought separately.

Language English/French

Services Read Online (No printing ) kr 2 570,00 Printed and bound Delivery time: 5-10 days kr 3 212,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.

Document information

Consolidated from IEC
Published: 10 August 2011
Withdrawn: 17 August 2020
Edition: 1.1
Version: 1
Document type: IS
Pages
ISBN: 9782889126095

ICS 31.080.01
ISO TC TC 47

Product Relations

Revised by: IEC 60749-30:2020 RLV
Revised by: IEC 60749-30:2020 ED2
Replaces: IEC PAS 62182:2000 ED1

IEC 60749-30:2005+AMD1:2011 CSV

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

IEC 60749-30:2020 ED2