Standard

IEC 60749-25:2003 ED1

Jul 2003 Published

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Abstract

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Document information

Standard from IEC
Published: 11 July 2003
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47

Product Relations

Replaces: IEC PAS 62178:2000 ED1
Partially replaces: IEC 60749:1996 ED2
Adopted by: NEK IEC 60034-11-3:1984

IEC 60749-25:2003 ED1

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