Consolidated

IEC 60749-19:2003+AMD1:2010 CSV

Nov 2010 Published

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Abstract

IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Document information

Consolidated from IEC
Published: 29 November 2010
Edition: 1.1
Version: 1
Document type: IS
Pages
ISBN: 9782889122455

ICS 31.080.01
ISO TC TC 47

Product Relations

Adopted by: NEK ISO/IEC 22535:2009

IEC 60749-19:2003+AMD1:2010 CSV

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