Standard

IEC 60749-16:2003 ED1

Jan 2003 Published

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Standard
IEC 60749-16:2003 ED1
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Jan 2003 Published
Standard
IEC PAS 62171:2000 ED1
Guidelines for particle impact noise detection (PIND) testing, operator training and certification
Aug 2000 Replaced

Abstract

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Document information

Standard from IEC
Published: 17 January 2003
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47

Product Relations

Replaces: IEC PAS 62171:2000 ED1

IEC 60749-16:2003 ED1

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