Consolidated

IEC 60691:2002+AMD1:2006+AMD2:2010 CSV

Feb 2010 Revised

Note: This standard has a new edition: IEC 60691:2023+AMD1:2024 CSV

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Language English/French

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Abstract

IEC 60691:2002+A1:2006+A2:2010 Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard. This consolidated version consists of the third edition (2002), its amendment 1 (2006) and its amendment 2 (2010). Therefore, no need to order amendments in addition to this publication.

Document information

Consolidated from IEC
Published: 25 February 2010
Withdrawn: 8 October 2015
Edition: 3.2
Version: 1
Document type: IS
Pages
ISBN: 9782832222034

ICS 29.120.50
ISO TC TC 32/SC 32C

Product Relations

Revised by: IEC 60691:2015+AMD1:2019 CSV
Revised by: IEC 60691:2015 ED4
Revises: IEC 60691:1993+AMD1:1995+AMD2:2000 CSV
Adopted by: NEK ISO/IEC 14495-1:1999
Revises: IEC 60691:1993 ED2

IEC 60691:2002+AMD1:2006+AMD2:2010 CSV

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IEC 60691:2023+AMD1:2024 CSV

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IEC 60691:2015 ED4