Standard

IEC 60684-3-281:2010 ED1

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Abstract

IEC 60684-3-281:2010 gives the requirements for two types of heat-shrinkable, polyolefin sleeving, semiconductive, with a nominal shrink ratio of 3:1. This sleeving has been found suitable up to temperatures of 100 °C. - Type A: Thin wall - Internal diameter up to 195,0 mm typically; - Type B: Medium wall - Internal diameter up to 120,0 mm typically

Document information

  • Standard from IEC
  • Published:
  • Edition: 1
  • Version: 1
  • Document type: IS
  • Pages
  • ICS 29.035.20
  • ISO TC TC 15

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