Standard

IEC 60317-55:2007 ED1

Nov 2007 Revised

Note: This standard has a new edition: IEC 60317-55:2013+AMD1:2019 CSV

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Abstract

This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin.

Document information

Standard from IEC
Published: 27 November 2007
Withdrawn: 14 October 2013
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 2831894085

ICS 29.060.10
ISO TC TC 55

Product Relations

Revised by: IEC 60317-55:2013+AMD1:2019 CSV
Revised by: IEC 60317-55:2013 ED2
Adopted by: NEK IEC 60269-1:1998

IEC 60317-55:2007 ED1

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IEC 60317-55:2013+AMD1:2019 CSV

IEC 60317-55:2013 ED2