Consolidated

IEC 60317-0-1:1997+AMD1:1999+AMD2:2005 CSV

Nov 2005 Revised

Note: This standard has a new edition: IEC 60317-0-1:2013+AMD1:2019 CSV

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Language English/French

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Abstract

Specifies the general requirements of enamelled round copper winding wires with or without bonding layer. This publication supersedes IEC 60182-1 (1984) and IEC 60182-2 (1987). This consolidated version consists of the second edition (1997), its amendment 1 (1999) and its amendment 2 (2005). Therefore, no need to order amendments in addition to this publication.

Document information

Consolidated from IEC
Published: 21 November 2005
Withdrawn: 11 March 2008
Edition: 2.2
Version: 1
Document type: IS
Pages
ISBN: 283188313X

ICS 29.060.10
ISO TC TC 55

Product Relations

Revised by: IEC 60317-0-1:2008 ED3
Revises: IEC 60317-0-1:1990 ED1

IEC 60317-0-1:1997+AMD1:1999+AMD2:2005 CSV

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IEC 60317-0-1:2013+AMD1:2019 CSV

IEC 60317-0-1:2013 ED4

IEC 60317-0-1:2008 ED3