Consolidated

IEC 60191-4:2013+AMD1:2018 CSV

Mar 2018 Published

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Abstract

IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code "S" is added to indicate a silicon based package. b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.

Document information

Consolidated from IEC
Published: 27 March 2018
Edition: 3.1
Version: 1
Document type: IS
Pages
ISBN: 9782832255322

ICS 31.080.01
ISO TC TC 47/SC 47D

Product Relations

Revises: IEC 60191-4:1999+AMD1:2001+AMD2:2002 CSV
Revises: IEC 60191-4:1999 ED2

IEC 60191-4:2013+AMD1:2018 CSV

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