Standard

IEC 60191-3:1974 ED1

Jan 1974 Revised

Note: This standard has a new edition: IEC 60191-3:1999 ED2

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Language English/French

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Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits Revised IEC 60191-3:1974/AMD2:1995 ED1 Amendment from Publication date: Nov 1995 Version: 1 Pages: 7 Language: English/French Services: Read Online (No printing ), Printed and bound
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Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits Revised IEC 60191-3:1974/AMD1:1983 ED1 Amendment from Publication date: Jan 1983 Version: 1 Pages: 5 Language: English/French Services: Read Online (No printing ), Printed and bound

Abstract

Gives general rules to be used for the preparation of outline drawings of integrated circuits and indicates how to number integrated circuit case leads.

Document information

Standard from IEC
Published: 1 January 1974
Withdrawn: 29 October 1999
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 2831803241

ICS 31.080.01
ISO TC TC 47/SC 47D

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Adopted by: NEK IEC 60335-2-62:2002
Revised by: IEC 60191-3:1999 ED2
Adopted by: NEK IEC 60342-2:1982

IEC 60191-3:1974 ED1

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IEC 60191-3:1999 ED2

IEC 60191-3:1974 ED1

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Version history Related corrigendum and amendments (2)

IEC 60191-3:1974/AMD2:1995 ED1

IEC 60191-3:1974/AMD1:1983 ED1

Version history History (2)

IEC 60191-3:1999 ED2

IEC 60191-3:1974 ED1

Abstract

Document information

Product Relations

Product life cycle