Standard

IEC 60068-2-83:2011 ED1

Sep 2011 Published

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Abstract

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Document information

Standard from IEC
Published: 7 September 2011
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 19.040
ICS 31.190
ISO TC TC 91

IEC 60068-2-83:2011 ED1

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Abstract

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