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Standard

NEK IEC 60749-21:2004

Tilbaketrukket

Merknad: Denne standarden har en ny utgave: NEK IEC 60749-21:2011

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Omfang

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Tilbaketrukket:
  • Utgave: 1.0
  • Versjon: 1
  • Varetype: NAT
  • Products.Specs.pages
  • ICS 31.080.01
  • National Committee NEK/NK47

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