Standard

SN-CWA 18311:2025

Jan 2026 Published

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Language English

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Abstract

This CWA defines requirements and recommendations for recycling and repair aspects for printed board assemblies (PBAs) and could provide the basis for the repair and recycling related section in a future digital product passport for PBAs. The document excludes the definition of an IT infrastructure and is orientated on the current developments of CEN/CLC-JTC 24 - DPP.

Document information

Standard from SN
Published: 12 January 2026
Edition: 2025-12
Version: 1
Document type: CWA
ISBN:

ICS 13.020.60
ICS 13.030.50
ICS 31.180
National Committee CEN/CLC/WS PCB

Product Relations

Joinded work item: NEK CWA 18311:2025
Refers: IEC 61340-5-1:2024 CMV
Refers: IEC 61340-5-1:2024 ED3
Adopted from: CWA 18311:2025

SN-CWA 18311:2025

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Abstract

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Abstract

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