Standard

NEK IEC PAS 62204:2000

Nov 2000 Withdrawn

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Language English

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Abstract

Aims at determining the temperature coefficient of resistance (at a given reference temperature) of aluminium and aluminium-alloy thin-film metallization that are used in microelectronic circuits and devices. This method is intended for estimating a mean temperature of a metallization line stressed in an accelerated electromigration stress test before any irreversible change in resistivity occurs due to the current-density and temperature stresses imposed.

Document information

Standard from NEK
Published: 28 November 2000
Withdrawn: 17 May 2004
Edition: 1.0
Version: 1
Document type: PAS
ISBN:

ICS 31.080.01
National Committee NEK/NK47

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Adopted from: IEC PAS 62204:2000

NEK IEC PAS 62204:2000

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Abstract

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Abstract

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