Standard

NEK IEC PAS 62173:2000

Withdrawn

Corrigendums and amendments are bought separately.

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Abstract

Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment. Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.

Document information

  • Standard from NEK
  • Published:
  • Withdrawn:
  • Edition: 1.0
  • Version: 1
  • Document type: PAS
  • Pages
  • ICS 31.080.01
  • National Committee NEK/NK47

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